ATE Board to DUT
High Performance Test Sockets and Contactors:
Introducing: INVISPIN®, our newest offering for individual pin interconnects. Pick and place compatible, individually replaceable and infinitely configurable. R&D Interconnect Solutions ATE Board to DUT Test Sockets specializes in medium-to-high-volume, high-density, small-pitch Gigahertz interconnection systems for various electronic industries. Our emphasis is on product innovation for customer applications where the edge rates are fast, the space is limited, the reliability demands are high, and the cost sensitivity is critical.
R&D Interconnect Solutions has expertise in providing low-insertion loss separable interconnects for high- frequency IC devices in BGA, LGA, QFP/SO, QFN/DFN, and fine-pitch BGA packaging. Products and technologies are aimed at providing cost-effective ways to socket IC devices with solderless compression mount techniques.
Engineering Development and Characterization:
Engineering Sockets are high-performing test solutions giving you visible results. They are proven solutions for BGA, LGA, leaded and leadless devices with lid options to allow for testing devices in development or doing failure analysis. Put our INVISIPIN® to the test.
Production ATE Contactors:
Higher-performing devices in RF, High Speed Digital, and mix signal demand high-performance contactors. R&D ATE solutions offer high- frequency tests with net transparent effects on your test results, all of which improve yields, up-binning, and reduce test cost. We also achieve high mechanical life and quick maintenance cycles with replaceable contact sets and replaceable individual elastomer columns. All these features and procedures grant you reliable electrical and mechanical performance over multiple cycles.
Test Socket Contactor Lids:
R&D Interconnect Solutions provide a wide variety of lids featuring outstanding mechanical stability for superior electrical connections. Easy-to-use and very cost effective, these socket lids have been designed to help you quickly and effortlessly test a broad range of devices.
|Pitch||0.2 to 1.27 mm|
|Number of Pins||100 to 10,000|
Spring Pin / Probe
|Socket IC Devices||Solderless Compression Mount
|Testing||Devices in Development
|Production Volume||1 to 100 units
Small Volume Prototype
|Typical Lead Times||Design: 2-4 weeks
Assembly: 5 days
Test: 5 days
|Industry Focus||High Frequency RF
|Intended Application||Printed Circuit Board (PCB)
Printed Wiring Board (PWB)
High Density Interconnect
|Industry Standards||ISO 9001:2008
|File Formats||Cadence Allegro