Board to Board Interconnects
Packaging challenges continue to drive the need for higher I/O counts, finer pitch and reduced test costs. R&D Interconnect Solutions Elastech® B2B interconnects, enable these attributes and more. Our new INVISIPIN® elastomer buttons installed on both sides of a substrate or carrier offer the high speed performance many of today’s devices require. These carriers are not restricted to materials or dimension and may be manufactured from standard flexible circuit materials or rigid PWB laminates. RDIS B2B elastomers can be fully engineered and designed to meet any footprint and space needs, from 1.5mm pitch down to 0.4mm pitch for B2B applications. Low per pin force at less than 20g per pin, with unparalleled electrical performance at <1db loss at 50 GHz will meet or exceed your current and future requirements.